SE97B_1
?NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 27 January 2010
36 of 53
NXP Semiconductors
SE97B
DDR memory module temp sensor with integrated SPD
9.1 SE97B in memory module application
Figure 21
shows the SE97B being placed in the memory module application. The SE97B
is centered in the memory module to monitor the temperature of the DRAM and also to
provide a 2-kbit EEPROM as the Serial Presence Detect (SPD). In the event of
overheating, the SE97B triggers the EVENT
output and the memory controller throttles
the memory bus to slow the DRAM. The memory controller can also read the SE97B and
watch the DRAM thermal behavior, taking preventive measures when necessary.
9.2 Layout consideration
The SE97B does not require any additional components other than the host controller to
read its temperature. It is recommended that a 0.1 糉 bypass capacitor between the V
DD
and V
SS
pins is located as close as possible to the power and ground pins for noise
protection.
9.3 Thermal considerations
In general, self-heating is the result of power consumption and not a concern, especially
with the SE97B, which consumes very low power. In the event the SDA and EVENT
pins
are heavily loaded with small pull-up resistor values, self-heating affects temperature
accuracy by approximately 0.5 癈.
Equation 1
is the formula to calculate the effect of self-heating:
(1)
where:
擳 = T
j
T
amb
T
j
= junction temperature
T
amb
= ambient temperature
R
th(j-a)
= package thermal resistance
V
DD
= supply voltage
I
DD(AV)
= average supply current
Fig 21. System application
002aae31
SE97B
EVENT
DIMM
DRAM
DRAM
DRAM
DRAM
MEMORY CONTROLLER
SMBus
CPU
?SPAN class="pst SE97BTP-547_2318313_14">T R
th j-a
( )
V
DD
I
DD AV
( )
?/DIV>
(
) V
OL SDA
(
)
I
OL
k
sin
(
) SDA
(
)
?/DIV>
(
) V
OL EVENT
(
)
I
OL
k
sin
(
)EVENT
?/DIV>
(
)
+
+
[
]
?/DIV>
=
发布紧急采购，3分钟左右您将得到回复。
相关PDF资料
SE98ATP,547
IC TEMP SENSOR DDR 8-HWSON
SG6901ASZ
IC PFC CTLR AVERAGE CURR 20SOIC
SG6932SZ
IC PFC CONTROLLER CCM 16SOP
SG6961SY
IC PFC CTRLR AVERAGE CURR 8SOIC
SI3500-A-GM
IC POE SWITCH PWR OVER LAN 20QFN
SI786LSG-E3
IC REG QD BUCK/LINEAR 28SSOP
SIC417CD-T1-E3
IC REG DL BCK/LINEAR SYNC 32MLPQ
SP619EK-L/TR
IC HIGH CURRENT SW SOT23-6
相关代理商/技术参数
SE97PW
制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:DDR memory module temp sensor with integrated SPD, 3.3 V
SE97PW,118
功能描述:板上安装温度传感器 I2C LOCAL +/- 2OC RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor
SE97PW-T
功能描述:板上安装温度传感器 I2C LOCAL +/- 2OC TS +SPD DIMM RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor
SE97TK
制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:DDR memory module temp sensor with integrated SPD, 3.3 V
SE97TK,118
功能描述:板上安装温度传感器 I2C LOCAL +/- 2OC RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor
SE97TK-T
功能描述:板上安装温度传感器 I2C LOCAL +/- 2OC TS +SPD DIMM RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor
SE97TL
制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:DDR memory module temp sensor with integrated SPD, 3.3 V
SE97TL,118
功能描述:板上安装温度传感器 I2C LOCAL +/- 2OC TS +SPD DIMM RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor